I just created a board that used a copper area as a heat sink for a surface mount part. The problem is that the solder mask covers the copper area. It did not appear this way in preview. The board manufacturer told me I needed to "Create a relief." Anyone have some experience with creating heat sinks out of copper areas? 2nd, when should I use multiple layers for heat sinks and what is the best VIA choice (shape) and spacing?
Select required net (0 for ground) > draw powerplane as need, thermal relief will be added for you if the pad/tab is part of the net list, if not, assign it in your netlist....problem solved.
