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Video: Inverter design tradeoffs for photovoltaic microinverters and microconverters

Dr. Olivier Trescases discusses performance analysis and design tradeoffs and including cost and energy efficiency for photovoltaic microinverters and microconverters. This is a 10 minute excerpt from the IEEE Spectrum webcast, Accelerating Development of Smart Grid Power Electronics Control Systems with RCP and HIL Techniques.

Speaker Bio:

Olivier Trescases received his Ph.D. degree in Electrical and Computer Engineering from the University of Toronto. His Ph.D. dissertation dealt with high-efficiency, digitally controlled integrated switched-mode power supplies for portable applications. Dr. Trescases has published over 35 conference and journal papers in IEEE power electronics conferences. He received two best-paper awards, one IEEE Vehicular Technology award as well as the 2010 Green Innovation Award from the City of Toronto. From 2007 to 2009, he worked as a concept engineer and mixed-signal circuit designer at Infineon Technologies in Villach, Austria. While at Infineon, he designed application-specific ICs in BCD (Bipolar/CMOS/DMOS) fabrication technologies for safety-critical automotive applications, such as electronic control units for airbag modules. He is the co-inventor for three patents. In January 2009 Dr. Trescases joined the Department of Electrical and Computer Engineering at the University of Toronto as an Assistant Professor, where he conducts research on power electronics for automotive, industrial, aerospace and photovoltaic (solar) applications. He is currently engaged in a number of industrial research projects dealing with distributed maximum power point tracking for solar applications, power converters for high-brightness LEDs, battery-management circuits for electric vehicles, integrated power converters and digital control schemes. He is a member of the executive committee for the IEEE Toronto Section. He has experience in a wide range of topics in the field of power electronics, such as digital control, efficiency optimization, mixed-signal IC design, protection schemes, system-level modeling, device-level design, packaging, and power transistors.

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