Multisim and Ultiboard

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Thermal Relief defaults

I would like to make a request regarding the default thermal relief sizes.  They are way too large when set to "Use Polygon Settings" + "Automatic" on the copper pour.

 

I'd like to recommend default to IPC-2221 which is Total Thermal Width = 60% pad size so for a 4 spoke thermal divide that number by 4 with a minimum of the min trace width from DRC.  The default wants to put something like 4x 90 mil spokes on a 160 mil pad which is damned hard to solder to.  By comparison, the IPC standard would be 24 mil spokes.  It would be nice if Ultiboard used that or something similar so I didn't have to go through the design setting them by hand.

 

I welcome any comments if I'm missing something here.

 

Best regards,

Mike

 
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Hi Mike,

 

There are two ways to change the spoke size in Ultiboard, you can change base on the copper pour or for a specific component.

 

To change thermal size copper pour, after placing the pour double-click on it then select the Copper Area tab, the spoke width can be set in the "Spoke width" field.

 

If you want a component to have different size than the copper area setting, double-click on the pad then select the "Thermal relief" tab, there should be a spoke field. You don't have to change individual pad setting, turn on only the pad selection filter then Ctrl+A, when you change the thermal spoke for one pad, all the selected pads will change also. You should do this in the component editor or the in-place edit where you can save the part to your database.

 

Related links:

 

Using the Ultiboard Selection Filter

How to Modify a Ultiobard footprint from the master database

Create a Custom Component in NI Ultiboard

 

Right now, the ability to change the thermal based on percentage of the pad size is not available, I can put in a request.

Tien P.

National Instruments
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Hi,

Is it possible you can't see these changes in 3D view? 

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The 3D preview should show the thermal relief, here is a screen capture of the copper bottom layer.

Tien P.

National Instruments
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